Michael Fancher, M.A.
Director, Advanced Manufacturing Performance Center
Director NYS Center for Advanced Technology in Nanoelectronics & Nanomaterials (CATN2)
Principal Investigator: Cyber-Physical Systems, Clean Energy Projects, and Entrepreneurial Programs.
Michael Fancher has over three decades of experience in industry, government and academia that includes over 20 years providing executive leadership at SUNY Polytechnic Institute College of Nanoscale Science and Engineering for business development and economic outreach. As the Director of the NYS Center for Advanced Technology in Nanoelectronics and Nanomaterials, he has successfully developed a broad array of innovative public private partnerships that support manufacturing consortia, technology commercialization, clean energy programs, entrepreneurial acceleration, workforce education, and regional cluster formation. Most notably, he has been directly responsible for the successful award of funding to establish the U.S. Photovoltaic Manufacturing Consortium (U.S. PVMC), the New York Power Electronics Manufacturing Consortium (NY-PEMC), and the American Institute for Manufacturing of Integrated Photonics (AIM Photonics), and regional eco-system growth strategies. He is the Principal Investigator (PI) on federal and state grants to establish the Advanced Manufacturing Performance (AMP) Center and an array of projects and programs in cyber-physical systems, clean energy and entrepreneurial growth. He has previously served as Deputy Director of Budget Studies for the New York State Assembly Ways and Means Committee and practiced as a Certified Public Accountant in New York State.
Contact: firstname.lastname@example.org 
SUNY Polytechnic Institute: https://sunypoly.edu/ 
Max Lippitt, Ph.D.
SUNY Research Foundation AMP Project Engineer
Manager-Engineer-Teacher with broad semiconductor Research and Development process, materials, and equipment knowledge in cutting edge 300mm technologies. Awarded fourteen patents in the field of semiconductor process R&D as a technologist working at Bell Labs, Texas Instruments, Globalfoundies, and IBM.
Evaluated, selected, installed, developed processes/materials, and released into Production Physical Vapor Deposition, Chemical Vapor Deposition, Wet Cleans, and Diffusion equipment. Knowledge in the use of MES, SPC, SAS JMP, RGA, spectrophotometry, pressure, and plasma wavelength endpoint detention allowed the exploitation of process equipment capabilities beyond OEM specifications.
Able to bridge the gap between Process and Equipment engineering with vast experience in both R&D process and tool installations. Subject expert on advanced process equipment installations including orchestrating complex facilities cut-sheets from tool vendor installation guides.
Shared knowledge and skills by developing semiconductor process teaching curriculum and holding classes across a broad audience – from high school to Ph.D. and C suite. Honed teaching skills in in-house and seminar break-out sessions at Texas Instruments and Globalfoundries. Presentations, at-desk labs, and sub-class teams to build team camaraderie kept the class lively and interactive.
Ross F. Goodman, Esq.
NYS Center for Advanced Technology in Nanomaterials and Nanoelectronics, and
NYS Center of Excellence in Nanoelectronics and Nanotechnology
Developed and coordinated strategic consortia, center, and program activities that have resulted in more than $500 million of public and private investments through industry, university and government partnerships in diverse technology areas that include: semiconductor, photovoltaic, power electronics and silicon photonics.
Instructional Support Technician
Stephen Stewart, Instructional Support Technician, Academic Engineering Support Group, SUNY PI. (20 years U.S. Navy nuclear reactor operator, Quality Assurance Supervisor Submarine Base New London, CT, 5 years Varian Semiconductor as an Ion Implantation Instructor, 20 years at SUNY PI.)
I develop course matter and instruct a number of nanoscale science components both analytical and process for SUNY CNSE undergraduate, graduate students, vacuum technology, and assembly technics for Northeast Advanced Technology Education Center, NYCREATES, and New York community college technology classes. Additionally, my academic work involves STEM outreach programs both foreign and domestic.
My technical support frequently includes; selection and installation of new equipment, design and construction of prototype equipment and control systems, lab renovations with cost analysis and project management, and process support for our tenants and startup customers.
I hold a Bachelor’s of Science in Business Administration and serve on the Mohonasen Business Advisory Board and the New Visions Engineering Advisory Committee Otsego Northern Catskills BOCES.
Robert Geer, Ph.D.
Professor of Nanoscale Science
Complemented by nanoscale structural and electrical characterization techniques, the nanomechanical metrology development activities are opening new areas of quantitative mechanical analysis of nanomaterials. Strongly complementing these efforts are recent investigations into near-field scanning optical spectroscopy for strain metrology of nanoelectronic devices. This research utilizes surface plasmon resonances of illuminated, metallized nano-tip structures to produce a nanoscale evanescent optical probe capable of generating optical excitation (fluorescence, Raman scattering) from a nanoscale region of a sample of interest. This approach is currently being used to investigate strain in Si-based structures.
A second area of interest concerns investigations of self-assembling, DNA-based molecular wires and devices for next generation integrated circuits. This research focuses on manipulating the self-assembly of beta-sheet proteins to form nanoscale conductive structures suitable for molecular electronic applications. Dip-pen nanolithography is currently being applied to these materials to controllably deposit test structures suitable for electrical and structural characterization for prototypical molecular-electronic device architectures.
Lastly, Professor Geer’s group is very active in nanomechanical processing for planarization in IC fabrication, so-called chemical-mechanical planarization (CMP). New CMP protocol development is undertaken with commercial CMP materials suppliers to support standard and novel planarization processing for a variety of CNSE nanoelectronics programs including 3D electronics.Professor Geer’s research has been supported by the National Science Foundation, the Semiconductor Research Corporation, the Office of Naval Research, the New York State Office of Academic Research and Technology, the Dow Chemical Company, the Dow-Corning Corporation, W. L. Gore, Inc., the Defense Advanced Research Projects Agency (DARPA), Raytheon Vision Systems, Advanced Micro Devices (AMD) and the Microelectronics Advanced Research Corporation (MARCO).
Assistant Vice President for Module Engineering
Gregory Denbeaux Ph. D.
Project Manager Vacuum Systems & TGMS Data Analytics Test-beds, Associate Professor of Nanoscience
Denbeaux’s research on magnetic materials focuses on nanometer-scale magnetism and magnetic recording. The magnetic storage density on commercial hard disk drives has been dropping by nearly a factor of two each year. This has led to magnetic features on the magnetic media approaching the grain size in the magnetic layer. Denbeaux’s research is to study the interactions between the grains and the magnetic properties. The magnetic studies are done using an x-ray microscope and a contrast mechanism known as x-ray magnetic circular dichroism. This technique provides image resolution below 20 nm coupled with the ability to apply magnetic fields during imaging and the ability to directly determine the magnetization within each layer of a multilayer material.
Eric Eisenbraun Ph.D.
Assistant Professor of Nanoscience
The second area is advanced interconnects. This includes developing refractory metal-based barrier/adhesion layers such as TiSiN and HfN for copper metallization, and researching how these layers can be integrated with cutting edge porous low-k dielectric interlayer dielectric materials.The third area involves the development processes for the growth of refractory metal-based materials such as TaN and SiCN for use as corrosion resistant and wear-resistant coatings. These have a broad range of particular applications.The fourth area is researching very novel materials for very advanced interconnect and device applications. This includes working jointly with other researchers to develop bioengineered protein-based molecular systems for use as nanoscale interconnect and device applications.
Advanced Manufacturing Workforce and Data Platform Coordinator
Patrizia Burinska received her B.S. degree in Nanotechnology Entrepreneurship with minor in Business from University at Albany. She supports the development of a website project for the Center for Advanced Technology in Nanoelectronics and Nanomaterials (CATN2) with focus on technical support, design and development. She also manages AMP website and provides administrative support.